AJX-12NIR Industrial infrared microscopy imaging systems can observe the interior of packaged chips and wafers in real-time.

The infrared band (900-1700nm)has a wide spectral range, small scattering, and strong penetration into silicon wafers (germanium wafers).

It adopts wide-field illumination and area array detection to achieve wide spectrum, large field of view, and high-resolution imaging.

The large numerical aperture objective lens(with an adjusting ring)can eliminate aberrations caused by the coverage of the object to be measured, achieving effective and accurate infrared detection.